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Silicon carbide for semiconductors
Silicon carbide for semiconductors
Silicon carbide for semiconductors
Silicon carbide for semiconductors
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  • Silicon carbide for semiconductors
  • Silicon carbide for semiconductors
  • Silicon carbide for semiconductors
  • Silicon carbide for semiconductors

Silicon carbide for semiconductors


Substrates, electrodes, heat sinks, and other components used for manufacturing semiconductor devices.
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Product Features and Applications

Due to the high strength and high density characteristics of silicon carbide ceramics, they are very suitable for manufacturing various structural components in the semiconductor industry. For example, silicon carbide ceramics can be used to manufacture substrates, electrodes, heat sinks, and other components of semiconductor devices. These components need to have high strength and high density to withstand the high temperatures and pressures generated during the operation of semiconductor devices.

Characteristics of Pressureless Sintered Silicon Carbide Ceramics

Pressureless sintered silicon carbide ceramics are made from high-purity, ultra-fine silicon carbide powder, with a small amount of sintering aids added, and sintered in an inert gas or vacuum atmosphere at a high temperature of 1950-2100°C under atmospheric pressure. The resulting products are almost completely dense and have excellent mechanical properties. Pressureless sintered silicon carbide ceramics include: sleeve products, sliding bearing products, mechanical sealing rings, flat rings, sandblasting nozzles, bulletproof plates, ceramic heating plates, ceramic heat distribution plates, 3D glass bending grinding tools, and ceramic plates for microchannel reactors.

Products from JNDE NEW MATERIAL Company made of silicon carbide ceramics have characteristics such as resistance to acid and alkali corrosion, high hardness and wear resistance, good self-lubrication, high temperature oxidation resistance, low thermal expansion coefficient, and good thermal conductivity. They are widely used in aerospace, automotive industry, petrochemical, mechanical sealing, metallurgy and power, pump equipment, thermal bending tools, microchannel reactors, new energy, semiconductors, scientific research, and national defense military industries.

Project

Unit

Index

Bulk Density

g/cm³

3.08-3.16

Hardness HV

kg/mm³

>2550

Compressive Strength

Mpa

>2500

Flexural Strength

Mpa

400-490

Silicon Carbide Content

%

>=99.2

Elastic Modulus

Gpa

>=410

Thermal Conductivity

W/m.k

100-120

Thermal Expansion Coefficient

i/℃

4.0

Porosity

%

<0.1

Poisson's Ratio

 

0.16

Operating Temperature

1900

Pressureless Sintered Ceramic Production Equipment

jinde

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